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KOKI Company Limited (Tokyo, Japan) is announcing the release of Halogen Free Solder Paste S3X58-HF1100-3 with multi-feature soldering performance, following the release of predecessor S3X58-HF1100. 

With conventional solder pastes, it is all too common that improving one feature results in the reduced performance of another, and that well-balanced high-performance general purpose solder pastes are hard to realize. Against many difficulties however, Koki’s newly developed solder paste S3X58-HF1100-3 has gained excellent performance in numerous features in one formulation by adopting our proprietary techniques “powerful-wetting” and “flux coagulation” 

The finer powder version (IPC Type 5), developed in pursuit of the trend of miniaturization at SMT process, S3X70-HF1100-3 is also available. 

S3X58-HF1100-3 (Sn 3.0Ag 0.5Cu) Type 4
S3X70-HF1100-3 (Sn 3.0Ag 0.5Cu) Type 5

Product Performance Table

A Solution to Just About All Soldering Requirements

S3X58-HF1100-3, by adopting newly developed techniques through our expertise and experiences, has gained excellent results in all soldering features such as wetting, flux splattering, voiding, printing, tackiness, electrical reliability, halogen free, etc.

Powerful Wetting Technique Advances Solder Joint Reliability

S3X58-HF1100-3 has applied a newly engineered flux technology in which solder particles are protected from being oxidized by an easy-to-remove protective layer and the antioxidant in the flux suppresses continued oxidation over time. Such effects help save the amount of activator needed for oxidation prevention, as well as the activator capping technique which allows maximum activation strength when the solder is molten.

Flux Coagulation Technique Improves First Pass Yield

The flux formulation of S3X58-HF1100-3 solder paste is specifically designed to exhibit enhanced flux coagulation at the time when the solder starts to melt.Instant coagulation and evacuation of the liquified flux when the solder gets molten,  brings about various benefits in soldering performance such as reduction in voiding rate and flux splattering, and improved wetting.